Transistor-Transistor
Logic
The most commonly used bipolar logic
family, there are many different TTL families, with a range of speed, power consumption,
and other characteristics. Eg., Low-power Schottky (LS or LS-TTL) which use
basically the same logic levels as the TTL-compatible CMOS families. For TTL
circuit behavior: LOW 0–0.8 volts. HIGH 2.0–5.0 volts.
Basic TTL NAND Gate
The circuit diagram for a two-input
LS-TTL NAND gate,
part number 74LS00, is shown in Fig.15. The NAND function is obtained by combining a
diode AND gate
with an inverting buffer amplifier. The circuit’s operation depends on three
parts i.e., Diode AND gate and input protection, Phase
splitter and Output stage.
Diodes D1X and D1Y and
resistor R1 form a diode AND gate. Clamp diodes D2X and D2Y do nothing in
normal operation, but limit undesirable negative excursions on the inputs to a
single diode drop. Such negative excursions may occur on HIGH-to-LOW input
transitions as a result of transmission-line effects.
Transistor Q2 and the
surrounding resistors form a phase splitter that controls the output
stage. Depending on whether the diode AND gate produces a “low” or a “high”
voltage at VA, Q2 is either cut off or turned on.
Fig.15: Two - input LS-TTL NAND gate (a) Circuit diagram (b)
Function Table (c) Truth Table (d) Logic Symbol
The output stage has two
transistors, Q4 and Q5, only one of which is on at any time. The
TTL output stage is sometimes called a totem-pole or push-pull output.
Similar to the p-channel and n-channel transistors in CMOS, Q4
and Q5 provide active pull-up and pull-down to the HIGH and
LOW states,
respectively.
The functional operation of the TTL NAND gate
is summarized in Fig.15 (b). The gate does indeed perform the NAND function,
with the truth table and logic symbol shown in (c) and (d).
TTL NAND gates can be designed with any desired
number of inputs simply by changing the number of diodes in the diode AND gate
in the figure. Commercially available TTL NAND gates have as many as 13 inputs. A TTL
inverter is designed as a 1-input NAND
gate, omitting diodes D1Y and D2Y
in Fig.15.
Since the output transistors Q4 and
Q5 are normally complementary—one
ON and
the other OFF—you
might question the purpose of the 120Ω resistor R5 in the output stage.
A value of 0Ω would
give even better driving capability in the HIGH state, certainly true from a DC point
of view.
But when the TTL output is changing
from HIGH to
LOW or
vice versa, there is a short time when both transistors may be on. The purpose
of R5 is to limit the amount of current that flows from VCC to
ground during this time. Even with a 120 Ω resistor in the TTL output stage,
higher-than-normal currents called current spikes flow when TTL outputs are
switched. These are similar to the current spikes that occur when high-speed
CMOS outputs switch.
(Reliable circuits require decoupling
capacitors between VCC and ground, distributed throughout the circuit so
that there is a capacitor within an inch or so of each chip. Decoupling
capacitors supply the instantaneous current needed during transitions.)
Fig.16: A TTL output driving a TTL input LOW
For the input signals to a TTL gate as
ideal voltage sources. Fig.16 shows the operation when a TTL input is driven LOW by
the output of another TTL gate. Transistor Q5A in the driving gate is ON
and thereby provides a path to ground for the current flowing out of the diode D1XB
in the driven gate. When current flows into a TTL output in the LOW state,
the output is said to be sinking current.
Fig.17: A TTL output driving a TTL input HIGH
Fig.17 shows the same circuit with a HIGH output
where Q4A in the driving gate is turned on enough to supply the small
amount of leakage current flowing through reverse-biased diodes D1XB and
D2XB in the driven gate. When current flows out of a TTL output in the HIGH state,
the output is said to be sourcing current.
Logic Levels and Noise
Margins
Consider TTL signals between 0 and 0.8
V to be LOW,
and signals between 2.0 and 5.0 V to be HIGH.
VOHmin - The minimum output voltage in the HIGH state,
2.7 V for most TTL
families.
VIHmin - The minimum input voltage guaranteed to be recognized as
a HIGH,
2.0 V for all TTL families.
Fig.18: Noise margins for popular TTL logic families
(74LS,74S, 74ALS, 74AS, 74F)
VILmax - The maximum input voltage guaranteed to be recognized as
a LOW,
0.8 V for most TTL families.
VOLmax - The maximum output voltage in the LOW state,
0.5 V for most families.
These noise margins are shown in Fig.18.
In the HIGH state,
the VOHmin specification of most TTL families exceeds VIHmin by
0.7 V, so TTL has a DC noise margin of 0.7 V in the HIGH state,
i.e., it takes at least 0.7 V of noise to corrupt a worst-case HIGH output
into a voltage that is not guaranteed to be recognizable as a HIGH input.
In the LOW state,
however, VILmax exceeds VOLmax by only 0.3 V, so the DC noise
margin in the LOW state
is only 0.3 V. In general, TTL and TTL-compatible circuits tend to be more
sensitive to noise in the LOW state than in the HIGH state.
Fanout
fanout is a measure of the number of gate
inputs that are connected to (and driven by) a single gate output. The DC
fanout of CMOS outputs driving CMOS inputs is virtually unlimited, because CMOS
inputs require almost no current in either state, HIGH or LOW. But for TTL inputs, there are very
definite limits on the fanout of TTL or CMOS outputs driving TTL inputs.
As in CMOS, the current flow in
a TTL input or output lead is defined to be positive if the current actually
flows into the lead, and negative if current flows out of the
lead. As a result, when an output is connected to one or more inputs, the
algebraic sum of all the input and output currents is 0.
The amount of current required by a TTL
input depends on whether the input is HIGH
or LOW, and is specified by two parameters:
IILmax - The maximum current that an input requires to pull it LOW.
Form Fig.16, positive current is actually flowing from VCC, through R1B, through diode D1XB,
out of the input lead, through the driving output transistor Q5A, and
into ground. Since current flows out of a TTL input in the LOW state,
IILmax has a negative value. Most LS-TTL inputs have IILmax = -0.4
mA, which is sometimes called a LOW-state unit load for LS-TTL.
IIHmax - The maximum current that an input requires to pull it HIGH.
As shown in Fig.17, positive current flows from VCC, through R5A and
Q4A of the driving gate, and into the driven input, where it leaks
to ground through reversed-biased diodes D1XB and D2XB. Since
current flows into a TTL input in the HIGH state, IIHmax has a positive value.
Most LS-TTL inputs have IIHmax = 20 mA, which is sometimes called a HIGH-state
unit load for LS-TTL.
Like CMOS outputs, TTL outputs can
source or sink a certain amount of current depending on the state, HIGH or
LOW:
IOLmax The maximum current an output can
sink in the LOW state
while maintaining an output voltage no more than VOLmax. Since current
flows into the output, IOLmax has a positive value, 8 mA for most LS-TTL
outputs.
IOHmax The maximum current an output can
source in the HIGH state
while maintaining an output voltage no less than VOHmin. Since current
flows out of the output, IOHmax has a negative value, -400
mA
for most LSTTL outputs.
The value of IOLmax for typical
LS-TTL outputs is exactly 20 times the absolute value of IILmax. As a
result, LS-TTL is said to have a LOW state fanout of 20, because an output can drive up
to 20 inputs in the LOW state.
Similarly, the absolute value of IOHmax
is exactly 20 times IIHmax, so LS-TTL is said to have a HIGH-state
fanout of 20 also. The overall fanout
is the lesser of the LOW- and HIGH-state fanouts.
Loading a TTL output with more than its
rated fanout has the same deleterious effects i.e, DC noise margins may be
reduced or eliminated, transition times and delays may increase, and the device
may overheat.
In general, two calculations must be
carried out to confirm that an output is
not being overloaded:
HIGH state
- The IIHmax values for all of the driven inputs are added. This sum must
be less than or equal to the absolute value of IOHmax for the driving
output.
LOW state
- The IILmax values for all of the driven inputs are added. The absolute
value of this sum must be less than or equal to IOLmax for the driving
output.
Eg., A system in which a certain LS-TTL
output drives ten LS-TTL and three S-TTL gate inputs.
In the HIGH state, a total of 10 × 20
+ 3 × 50
mA
= 350 mA
is required. This is within an LS-TTL output’s HIGH-state current-sourcing capability of
400 mA.
But in the LOW state, a total of 10 × 0.4
+ 3 × 2.0
mA = 10.0 mA is required. This is more than an LS-TTL output’s LOW-state
current-sinking capability of 8 mA, so the output is overloaded.
Unused Inputs
Unused inputs of TTL gates can be
handled in the same way as CMOS gates i.e., unused inputs may be tied to used
ones, or unused inputs may be pulled HIGH
or LOW as is appropriate for the logic
function.
The resistance value of a pull-up or
pull-down resistor is more critical with TTL gates than CMOS gates, because TTL
inputs draw significantly more current, especially in the LOW state.
If the resistance is too large, the voltage drop across the resistor may result
in a gate input voltage beyond the normal LOW or HIGH range.
Eg., consider the pull-down resistor
shown in Fig.19. The pull-down resistor must sink 0.4 mA of current from each
of the unused LS-TTL inputs that it drives. Yet the voltage drop across the
resistor must be no more than 0.5 V in order to have a LOW input voltage no
worse than that produced by a normal gate output. If the resistor drives n LS-TTL
inputs, then we must have
Fig.19: Pull-down resistor for TTL inputs
Thus, if the resistor must pull 10
LS-TTL inputs LOW,
then we must have Rpd <0.5 / (10 × 4 × 10-3), or Rpd < 125
W.
Similarly, consider the pull-up resistor shown in Fig.20.
Fig.20: Pull-up resistor for TTL inputs
It must source 20 mA
of current to each unused input while producing a HIGH voltage no worse than that produced by
a normal gate output, 2.7 V. Therefore, the voltage drop across the resistor
must be no more than 2.3 V; if n LS-TTL input are driven, we must have
Thus, if 10 LS-TTL inputs are pulled
up, then Rpu < 2.3 / (10 × 20×10-6), or
Rpu < 11.5 KW.
Additional TTL Gate
Types
Although the NAND gate is the “workhorse” of the TTL
family, other types of gates can be built with the same general circuit
structure. The circuit diagram for an LS-TTL NOR gate is shown in Fig.21.
Fig.21 Two-input LS-TTL NOR Gate (a)
Circuit Diagram (b) Function Table (c) Truth Table (d) Logic Symbol
If either input X or
Y is
HIGH,
the corresponding phase-splitter transistor Q2X or Q2Y is turned
on, which turns off Q3 and Q4 while turning on Q5 and Q6,
and the output is LOW. If both inputs are LOW,
then both phase-splitter transistors are off, and the output is forced HIGH.
This functional operation is summarized in Fig.21 (b).
The LS-TTL NOR gate’s input circuits, phase splitter,
and output stage are almost identical to those of an LS-TTL NAND gate.
The difference is that an LSTTL NAND gate uses diodes to perform the AND function,
while an LS-TTL NOR gate
uses parallel transistors in the phase splitter to perform the OR function.
The speed, input, and output
characteristics of a TTL NOR gate are comparable to those of a TTL NAND.
However, an n-input NOR gate uses more transistors and
resistors and is thus more expensive in silicon area than an n input NAND.
Also, internal leakage current limits the number of Q2 transistors that
can be placed in parallel, so NOR gates have poor fan-in. (The largest
discrete TTL NOR gate
has only 5 inputs, compared with a 13-input NAND.) As a result, NOR gates
are less commonly used than NAND gates in TTL designs. The most
“natural” TTL gates are inverting gates like NAND and NOR. Non-inverting TTL gates include an
extra inverting stage, typically between the input stage and the phase
splitter. As a result, non-inverting TTL gates are typically larger and slower
than the inverting gates on which they are based.
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